TIP 30 Series Thermal Soft Pad

Material Features Ultra Conformable,Thermally Conductive Material for Filling Air Gaps

As low as $283.2/m at 0% APR With paypal_credit

Describe： This flexible series is an electrically insulating thermally conductive high performance silicone gap filler. It is ideal for use in applications where a very good thermal transfer over large gaps caused e.g. by big tole_x005frances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the silicone elastomer has an extremely high thermal conductivity. Through its softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at low pressure. By its use the total thermal resistance is minimized. The natural tackiness of the material allows for an easy and reliable pre-assembly.

Thermal conductivity 2.0~3.0 W/m·K
"Low “S-Class” thermal resistance at very low pressures"
Highly conformable, low hardness
Designed for low-stress applications
"Fiberglass reinforced for puncture, shear and tear resistance"

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TCP300 Wholesale Thermal Conductive Silicone Pad Used in PCB

Products Features:

◇3.00 W/mk thermal conductivity
◇Low Thermal Resistance at Low Pressure
◇Naturally tacky for easy application

Typical Applications Include:

Between heat-generation component and heatsink
Led Solid State Lighting, Graphices Cards, Telecom device
Wireless communication hardware
Cooling Module, Thermal module.
High Power supply/conversion

Typical Properties of This Materials:

tcp300 thermal resistance vs pressure

Typical Properties of TCP300 Silicone Thermal Pad
Properties	Units	TCP300	Test Method
Material	---	Silicone	---
Color	---	Blue	Visual
Thickness Range	mm	0.25 to 15	---
Natural tacky (1- or 2-sided)	g/cm3	2	---
Hardness	Shore C	25,35	ASTM E1269
Density	g/cc	2.6	ASTM E595
Continuous Use Temp	℃	-60 to 200	EN344
ELECTRICAL
Breakdown Voltage(1mmT)	Kv/ac	≥6	ASTM D149
Volume Impedance	(ohm-cm)	≥1.1x10¹⁴	ASTM D257
Dielectric Constant	1MHz	6.8	ASTM D150
Flame Rating		V 0	UL 94
THERMAL
Thermal Conductivity	W/m.k	3.0	ASTM D5470